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L6210 Arkusz danych(PDF) 5 Page - STMicroelectronics

Numer części L6210
Szczegółowy opis  Dual Schottky diode bridge
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L6210 Arkusz danych(HTML) 5 Page - STMicroelectronics

  L6210_08 Datasheet HTML 1Page - STMicroelectronics L6210_08 Datasheet HTML 2Page - STMicroelectronics L6210_08 Datasheet HTML 3Page - STMicroelectronics L6210_08 Datasheet HTML 4Page - STMicroelectronics L6210_08 Datasheet HTML 5Page - STMicroelectronics L6210_08 Datasheet HTML 6Page - STMicroelectronics L6210_08 Datasheet HTML 7Page - STMicroelectronics L6210_08 Datasheet HTML 8Page - STMicroelectronics  
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L6210
Mounting instructions
5/8
3
Mounting instructions
The Rth j-amb of the L6210 can be reduced by soldering the GND pins to suitable copper
area of the printed circuit boards as shown in Figure 3 or to an external heatsink (Figure 4).
During soldering the pin temperature must not exceed 260°C and the soldering time must
not be longer then 12 s. The external heatsink or printed circuit copper area must be
connected to electrical ground.
Figure 3.
Example of PC board copper area which is used as heatsink
Figure 4.
Example of an external heatsink


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