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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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STPS1L40 Arkusz danych(PDF) 4 Page - STMicroelectronics |
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STPS1L40 Arkusz danych(HTML) 4 Page - STMicroelectronics |
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4 / 5 page  STPS1L40 4/7 Figure 11: Forward voltage drop versus forward current (typical values, high level) Figure 12: Forward voltage drop versus forward current (maximum values, low level) Figure 13: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMA) Figure 14: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMB) I (A) FM 0 100 200 300 400 500 600 700 800 900 1000 0.01 0.10 1.00 10.00 V (V) FM T =25°C j T =125°C j T =150°C j 0 100 200 300 400 500 600 700 800 0.0 0.5 1.0 1.5 2.0 2.5 3.0 I (A) FM V (V) FM T =25°C j T =125°C j T =150°C j 0123 4 5 0 20 40 60 80 100 120 140 S(Cu)(cm²) R (°C/W) th(j-a) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 20 40 60 80 100 120 S(Cu)(cm²) R (°C/W) th(j-a) |
Podobny numer części - STPS1L40 |
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Podobny opis - STPS1L40 |
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