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IRF840AL Arkusz danych(PDF) 2 Page - Vishay Siliconix |
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IRF840AL Arkusz danych(HTML) 2 Page - Vishay Siliconix |
2 / 8 page www.vishay.com Document Number: 91066 2 S-81412-Rev. A, 07-Jul-08 IRF840AS, IRF840AL, SiHF840AS, SiHF840AL Vishay Siliconix Note a. When mounted on 1" square PCB (FR-4 or G-10 material). Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width ≤ 300 µs; duty cycle ≤ 2 %. c. Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80 % VDS. d. Uses IRF840A/SiHF840A data and test conditions THERMAL RESISTANCE RATINGS PARAMETER SYMBOL MIN. TYP. MAX. UNIT Maximum Junction-to-Ambient (PCB Mount)a RthJA -- 40 °C/W Maximum Junction-to-Case (Drain) RthJC -- 1.0 SPECIFICATIONS TJ = 25 °C, unless otherwise noted PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = 250 µA 500 - - V VDS Temperature Coefficient ΔV DS/TJ Reference to 25 °C, ID = 1 mAd -0.58 - V/°C Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = 250 µA 2.0 - 4.0 V Gate-Source Leakage IGSS VGS = ± 30 V - - ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = 500 V, VGS = 0 V - - 25 µA VDS = 400 V, VGS = 0 V, TJ = 125 °C - - 250 Drain-Source On-State Resistance RDS(on) VGS = 10 V ID = 4.8 Ab - - 0.85 Ω Forward Transconductance gfs VDS = 50 V, ID = 4.8 A 3.7 - - S Dynamic Input Capacitance Ciss VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 - 1018 - pF Output Capacitance Coss - 155 - Reverse Transfer Capacitance Crss -8.0 - Output Capacitance Coss VGS = 0 V VDS = 1.0 V, f = 1.0 MHz 1490 Output Capacitance Coss VDS = 400 V, f = 1.0 MHz 42 Effective Output Capacitance Coss eff. VDS = 0 V to 480 Vc, d 56 Total Gate Charge Qg VGS = 10 V ID = 8.0 A, VDS = 400 V, see fig. 6 and 13b, d -- 38 nC Gate-Source Charge Qgs -- 9.0 Gate-Drain Charge Qgd -- 18 Turn-On Delay Time td(on) VDD = 250 V, ID = 8.0 A, RG = 9.1 Ω, RD = 31 Ω, see fig. 10b, d -11 - ns Rise Time tr -23 - Turn-Off Delay Time td(off) -26 - Fall Time tf -19 - Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current IS MOSFET symbol showing the integral reverse p - n junction diode -- 8.0 A Pulsed Diode Forward Currenta ISM -- 32 Body Diode Voltage VSD TJ = 25 °C, IS = 8.0 A, VGS = 0 Vb -- 2.0 V Body Diode Reverse Recovery Time trr TJ = 25 °C, IF = 8.0 A, dI/dt = 100 A/µsb - 422 633 ns Body Diode Reverse Recovery Charge Qrr -2.0 3.0 µC Forward Turn-On Time ton Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD) S D G |
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