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TC3341 Arkusz danych(PDF) 2 Page - Transcom, Inc. |
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TC3341 Arkusz danych(HTML) 2 Page - Transcom, Inc. |
2 / 3 page TC3341 REV2_20050418 TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P 2 / 3 Absolute Maximum Ratings Symbol Parameter/Conditions Min. Max. Units Vdd Drain-Source Voltage 12 Volts Idd Total Drain Current 2200 mA Pin RF Input Power 10 dBm Pt Power Dissipation 12 W Tch Operating Channel Temperature 175 °C TSTG Storage Temperature -65 175 °C Note: 1.This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. 2.Specifications subject to change without notice. TEST CIRCUITS Evaluation Board Schematic EVALUATION BOARD PCB Material: RO4003 ER = 3.38 Thickness = 20 mil Unit: mil * DXF file of the PCB can be downloaded from our web-site at www.transcominc.com.tw * Application Notes: For better heat sinking and grounding, it's recommended to have the via holes beneath TC3341 filled with solder and have two screws installed on required heat sink plate besides TC3341 on the PCB area. |
Podobny numer części - TC3341 |
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Podobny opis - TC3341 |
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