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ADA4856-3 Arkusz danych(PDF) 5 Page - Analog Devices |
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ADA4856-3 Arkusz danych(HTML) 5 Page - Analog Devices |
5 / 20 page ADA4856-3 Rev. 0 | Page 5 of 20 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3. Parameter Rating Supply Voltage 6 V Internal Power Dissipation1 See Figure 3 The maximum power that can be safely dissipated by the ADA4856-3 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. Common-Mode Input Voltage (−VS − 0.2 V) to (+VS − 1 V) Differential Input Voltage ±VS Output Short-Circuit Duration Observe power curves Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +105°C Lead Temperature (Soldering, 10 sec) 300°C To ensure proper operation, it is necessary to observe the maximum power derating curves. 1 Specification is for device in free air. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 3.0 2.5 2.0 1.5 1.0 0.5 0 AMBIENT TEMPERATURE (°C) THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, θJA is specified for a device soldered in a circuit board for surface-mount packages. Table 4. Package Type θJA θJC Unit 16-Lead LFCSP 67 17.5 °C/W Figure 3. Maximum Power Dissipation vs. Ambient Temperature ESD CAUTION |
Podobny numer części - ADA4856-3 |
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Podobny opis - ADA4856-3 |
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