Zakładka z wyszukiwarką danych komponentów |
|
TDA8950 Arkusz danych(PDF) 8 Page - NXP Semiconductors |
|
TDA8950 Arkusz danych(HTML) 8 Page - NXP Semiconductors |
8 / 39 page TDA8950_1 © NXP B.V. 2008. All rights reserved. Preliminary data sheet Rev. 01 — 9 September 2008 8 of 39 NXP Semiconductors TDA8950 2 × 150 W class-D power amplifier 8.2 Pulse width modulation frequency The output signal of the amplifier is a PWM signal with a carrier frequency that typically lies between 300 kHz and 400 kHz. Using a 2nd-order LC demodulation filter in the application results in an analog audio signal across the loudspeaker. The carrier frequency is determined by an external resistor ROSC, connected between pin OSC and pin VSSA. An optimal setting for the carrier frequency is between 300 kHz and 400 kHz. Using an external resistor of 30 k Ω on pin OSC, the carrier frequency is set to 345 kHz. For more details see Table 8. If two or more class-D amplifiers are used in the same audio application, it is recommended that all devices operate at the same switching frequency by using an external clock circuit. Due to an internal clock divider: • The external applied clock frequency must have the double frequency of the output PWM frequency. • The duty cycle of the external clock is not critical for product performance. 8.3 Protections The following protections are included in TDA8950: • Thermal protections: – Thermal FoldBack (TFB) – OverTemperature Protection (OTP) • OverCurrent Protection (OCP, diagnostic via pin PROT) • Window Protection (WP) • Supply voltage protections: – UnderVoltage Protection (UVP) – OverVoltage Protection (OVP) – UnBalance Protection (UBP) The reaction of the device to the different fault conditions differs per protection. 8.3.1 Thermal protection In the TDA8950 an advanced thermal protection strategy is implemented. It consists of a TFB function that gradually reduces the out put power within a certain temperature range. When temperature is still rising an OTP is implemented which shuts down the device completely. 8.3.1.1 Thermal FoldBack (TFB) If the junction temperature Tj exceeds a defined threshold value, the gain is gradually reduced. This will result in a smaller output signal and less dissipation. Eventually the temperature will stabilize. |
Podobny numer części - TDA8950 |
|
Podobny opis - TDA8950 |
|
|
Link URL |
Polityka prywatności |
ALLDATASHEET.PL |
Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |