SN54ABT827, SN74ABT827

10BIT BUFFERS/DRIVERS

WITH 3STATE OUTPUTS

SCBS159E − JANUARY 1991 − REVISED APRIL 2005

2

POST OFFICE BOX 655303

† This symbol is in accordance with ANSI/IEEE Std 91-1984 and

IEC Publication 617-12.

Pin numbers shown are for the DB, DW, JT, NT, and PW packages.

2

A1

3

A2

4

A3

5

A4

6

A5

Y1

23

Y2

22

Y3

21

Y4

20

Y5

19

Y6

18

Y7

17

Y8

16

7

A6

8

A7

9

A8

13

1

OE1

OE2

EN

&

Y9

15

Y10

14

10

A9

11

A10

1

logic diagram (positive logic)

Y1

To Nine Other Channels

OE1

OE2

A1

1

13

223

−0.5 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−0.5 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−0.5 V to 5.5 V

. . . . . . . . . . . . . . . . . . .

96 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SN74ABT827

128 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−18 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

104

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DW package

81

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NT package

67

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PW package

120

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages,

which use a trace length of zero.