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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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ADS-930MC Arkusz danych(PDF) 6 Page - Murata Power Solutions Inc. |
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ADS-930MC Arkusz danych(HTML) 6 Page - Murata Power Solutions Inc. |
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6 / 8 page  ADS-930 6 ® ® Gain Adjust Procedure 1. Apply +4.999771V to the ANALOG INPUT (pin 3) for bipolar gain adjust or apply –9.999771V to pin 3 for unipolar gain adjust. 2. For a unipolar input - adjust the gain potentiometer until all output bits are 1's and the LSB flickers between a 1 and 0 with pin 8 tied high (straight binary) or until all output bits are 0's and the LSB flickers between a 1 and 0 with pin 8 tied low (complementary binary). For a bipolar input - adjust the gain potentiometer until all output bits are 1's and the LSB flickers between a 1 and 0 with pin 8 tied low (complementary offset binary) or until all output bits are 0's and the LSB flickers between a 1 and 0 with pin 8 tied high (offset binary). 3. Two's complement coding requires using pin 40. With pin 8 tied high, adjust the gain trimpot until the output code flickers equally between 1000 0000 0000 0000 and 1000 0000 0000 0001. THERMAL REQUIREMENTS All DATEL sampling A/D converters are fully characterized and specified over operating temperature (case) ranges of 0 to +70°C and –55 to +125°C. All room-temperature (TA = +25°C) production testing is performed without the use of heat sinks or forced-air cooling. Thermal impedance figures for each device are listed in their respective specification tables. These devices do not normally require heat sinks, however, standard precautionary design and layout procedures should be used to ensure devices do not overheat. The ground and power planes beneath the package, as well as all pcb signal runs to and from the device, should be as heavy as possible to help conduct heat away from the package. Electrically- insulating, thermally-conductive "pads" may be installed underneath the package. Devices should be soldered to boards rather than "socketed", and of course, minimal air flow over the surface can greatly help reduce the package temperature. In more severe ambient conditions, the package/junction temperature of a given device can be reduced dramatically (typically 35%) by using one of DATEL's HS Series heat sinks. See Ordering Information for the assigned part number. See page 1-183 of the DATEL Data Acquisition Components Catalog for more information on the HS Series. Request DATEL Application Note AN-8, "Heat Sinks for DIP Data Converters," or contact DATEL directly, for additional data. Figure 4. FFT Analysis of ADS-930 Figure 3. ADS-930 Timing Diagram Note: Scale is approximately 50ns per division. START CONVERT INTERNAL S/H N 10ns min., 25ns max. EOC OUTPUT DATA Data N-1 Valid Hold 1.54µs typ. 140ns max. Data N Valid 1.39µs min. Invalid Data 460ns typ. 545ns max. Acquisition Time 10ns min. 25ns max. Conversion Time 700ns ±30ns 175ns min., 200ns typ., 215ns max . N+1 780ns ±30ns 30ns min . |
Podobny numer części - ADS-930MC |
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Podobny opis - ADS-930MC |
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