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FP0705R2-R07-R Arkusz danych(PDF) 4 Page - Cooper Bussmann, Inc.

Numer części FP0705R2-R07-R
Szczegółowy opis  High Current, Low-Profile Power Inductors
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Producent  COOPER [Cooper Bussmann, Inc.]
Strona internetowa  http://www.cooperbussmann.com
Logo COOPER - Cooper Bussmann, Inc.

FP0705R2-R07-R Arkusz danych(HTML) 4 Page - Cooper Bussmann, Inc.

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© 2008 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
05-05-08
BU-SB08210
Page 4 of 4
Data Sheet: 4325
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
Solder Reflow Profile
t
tP
ts
TC -5°C
Time 25°C to Peak
Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Taabbllee 1
1 -- S
Sttaan
nddaarrdd S
SnnP
Pb
b S
Soollddeerr ((TTcc))
Volume
Volume
Package
mm
3
mm
3
Thickness
<350
>
_350
<2.5mm
235°C
220°C
>
_2.5mm
220°C
220°C
T
Taab
bllee 2
2 -- LLeeaadd ((P
Pb
b)) FFrreeee S
Soollddeerr ((TTcc))
Volume
Volume
Volume
Package
mm
3
mm
3
mm
3
Thickness
<350
350 - 2000
>2000
<1.6mm
260°C
260°C
260°C
1.6 – 2.5mm 260°C
250°C
245°C
>2.5mm
250°C
245°C
245°C
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak• Temperature min. (Tsmin)
100°C
150°C
• Temperature max. (Tsmax)
150°C
200°C
• Time (Tsmin to Tsmax) (ts)
60-120 Seconds
60-120 Seconds
Average ramp up rate Tsmax to Tp
3°C/ Second Max.
3°C/ Second Max.
Liquidous temperature (TL)
183°C
217°C
Time at liquidous (tL)
60-150 Seconds
60-150 Seconds
Peak package body temperature (TP)*
Table 1Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)
20 Seconds**
30 Seconds**
Average ramp-down rate (Tp to Tsmax)
6°C/ Second Max.
6°C/ Second Max.
Time 25°C to Peak Temperature6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This
bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, with-
out notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any
technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company.
Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in significant injury to the user.


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