SN54HC174, SN74HC174

HEX D-TYPE FLIP-FLOPS

WITH CLEAR

SCLS119B – DECEMBER 1982 – REVISED MAY 1997

2

POST OFFICE BOX 655303

† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.

Pin numbers shown are for the D, J, N, and W packages.

R

1

9

CLK

C1

1D

3

1D

4

2D

6

3D

11

4D

13

5D

14

6D

1Q

2

2Q

5

3Q

7

4Q

10

5Q

12

6Q

15

CLR

logic diagram (positive logic)

1D

C1

R

To Five Other Channels

1

9

3

2

CLR

CLK

1D

1Q

Pin numbers shown are for the D, J, N, and W packages.

–0.5 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±25 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

113

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

N package

78

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace

length of zero.