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74712-0002 Arkusz danych(PDF) 1 Page - Molex Electronics Ltd. |
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74712-0002 Arkusz danych(HTML) 1 Page - Molex Electronics Ltd. |
1 / 2 page 6.25mm (.246”) Pitch Ganged RF 74642, 74712 Right Angle Receptacle and Vertical Header Ganged RF System Connects High Bandwidth RF Signals In Blind-Mate Daughtercard Receptacles and Backplane Headers The Ganged RF system offers customers innovative packaging with selectively loaded housings for connecting up to 2.5GHz single-ended or analog RF signals. The blind-mate right-angle daughtercard receptacles and vertical backplane headers are available in three- and four-port sizes with selective loading of high-performance vertical signal pairs. The press-fit terminals allow simple termination to the PCB with optional application tooling available from Molex. Options for cabling in both sizes are also available in several standard lengths to connect with the right-angle daughtercard receptacles. Features and Benefits s 50 Ohm ±10% matched impedance contact system for low insertion loss and optimal signal integrity s 60 db min. isolation to minimize crosstalk s Press-fit termination and locator pegs promote easy and reliable board termination s Modular assembly of vertical signal pairs allow custom loading s High-temperature 94V-0 housings with generous chamfers and blind-mating lead-ins for reliable and consistent mating s Contacts with 0.76µm (30µ”) min. gold plating on mating surfaces for excellent reliability SPECIFICATIONS Reference Information Packaging: Tray UL File No.: E107635 CSA File No.: 152514 (LR19980) Designed In: mm Electrical Voltage: 5.0 VAC Current: 1.0 A max. Contact Resistance: 35 milliohms max. Dielectric Withstanding Voltage: 1000 VAC min. Insulation Resistance: 1 Gigaohm min. Return Loss: 0-1.0GHz: 15dB, 1.4:1 VSWR 1.0-2.5GHz: 12dB, 1.7:1 VSWR Insertion Loss: 0.5dB max. Physical Housing and Insulator: 94V-0 high temperature thermoplastic Terminals and Grounds: Tin Brass Outer Ground Contact: Phosphor Bronze Plating: Terminals: 0.76µm (30µ”) min. Gold in contact area 0.88µm (35µ”) min. Tin/Lead selective Grounds: 0.88µm (35µ”) min. Tin/Lead overall Outer Ground Contact: 0.76µm (30µ”) min. Gold overall Underplating: 1.27µm (50µ”) min. Nickel PCB Thickness: Daughtercard 3.2mm (.125”) max. Backplane 4.5mm (.178”) max. Operating Temperature: -45 to 85° C Mechanical Contact Insertion Force: 5.0N (1.1lb) max. per contact Contact Retention to Housing: 5.0N (1.1lb) min. per module Insertion Force to PCB: 50N (11.2lb) max. per terminal Durability: 500 cycles |
Podobny numer części - 74712-0002 |
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Podobny opis - 74712-0002 |
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