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TL081ID Arkusz danych(PDF) 5 Page - Texas Instruments |
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TL081ID Arkusz danych(HTML) 5 Page - Texas Instruments |
5 / 19 page TL084Y JFET-INPUT QUAD OPERATIONAL AMPLIFIER SLOS081A–D2297, FEBRUARY 1977–REVISED NOVEMBER 1992 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 5 chip information These chips, when properly assembled, display characteristics similar to the TL084. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10% ALL DIMENSIONS ARE IN MILS PIN (11) INTERNALLY CONNECTED TO BACKSIDE OF CHIP + – 1 OUT 1 IN + 1 IN – VCC+ (4) (6) (3) (2) (5) (1) – + (7) 2 IN + 2 IN – 2 OUT (11) VCC – + – 3 OUT 3 IN + 3 IN – (13) (10) (9) (12) (8) – + (14) 4 OUT 4 IN + 4 IN – |
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