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FAN21SV06MPX Arkusz danych(PDF) 4 Page - Fairchild Semiconductor

Numer części FAN21SV06MPX
Szczegółowy opis  TinyBuck??6A, 24V Single-Input Integrated Synchronous Buck Regulator, Synchronization Capability
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Producent  FAIRCHILD [Fairchild Semiconductor]
Strona internetowa  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN21SV06MPX Arkusz danych(HTML) 4 Page - Fairchild Semiconductor

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© 2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN21SV06 Rev. 1.0.1
4
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Parameter
Conditions
Min.
Max.
Units
VIN, VIN_Reg to
AGND
AGND=PGND
28
V
5V_Reg to AGND
AGND=PGND
6
V
BOOT to PGND
35
V
BOOT to SW
-0.5
6.0
V
Continuous
-0.5
24.0
V
SW to PGND
Transient (t < 20ns, f < 600KHz)
-5
30
V
All other pins
-0.3
6.0
V
Human Body Model, JESD22-A114
1.5
ESD
Charged Device Model, JESD22-C101
2.5
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Conditions
Min.
Typ.
Max
Units
fSW
Switching Frequency
200
500
600
KHz
VIN to PGND
3.0
24.0
V
VIN,
VIN_Reg
Supply Voltage for Power and Bias
VIN_Reg to AGND
6.5
24.0
V
FAN21SV06MX
-10
+85
°C
TA
Ambient Temperature
FAN21SV06EMX
-40
+85
°C
TJ
Junction Temperature
+125
°C
Thermal Information
Symbol
Parameter
Min.
Typ.
Max.
Units
TSTG
Storage Temperature
-65
+150
°C
TL
Lead Soldering Temperature, 30sec
+300
°C
P1 (Q2)
4
°C/W
P2 (Q1)
7
°C/W
θJC
Thermal Resistance: Junction-to-Case
P3
4
°C/W
θJ-PCB
Thermal Resistance: Junction-to-Mounting Surface
(1)
35
(1)
°C/W
PD
Total Power Dissipation in the package, TA=25°C
(1)
2.8
W
Note:
1.
Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 37. Actual results
are dependent upon mounting method and surface related to the design.


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