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MC15XS3400CPNA Arkusz danych(PDF) 2 Page - Freescale Semiconductor, Inc |
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MC15XS3400CPNA Arkusz danych(HTML) 2 Page - Freescale Semiconductor, Inc |
2 / 51 page Analog Integrated Circuit Device Data 2 Freescale Semiconductor 15XS3400 DEVICE VARIATIONS DEVICE VARIATIONS Table 1. Device Variations Characteristic Symbol Min Typ Max Unit Wake Input Clamp Voltage, ICL(WAKE) < 2.5 mA 15XS3400C 15XS3400D VCL(WAKE) 18 20 25 27 32 35 V Fault Detection Blanking Time 15XS3400C 15XS3400D tFAULT - - 5.0 5.0 20 10 μs Output Shutdown Delay Time 15XS3400C 15XS3400D tDETECT - - 7.0 7.0 30 20 μs Peak Package Reflow Temperature During Reflow(1), (2) TPPRT Note 2 °C 1. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 2. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics. |
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