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540PY9C Arkusz danych(PDF) 7 Page - HB Electronic Components |
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540PY9C Arkusz danych(HTML) 7 Page - HB Electronic Components |
7 / 9 page 2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. FORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) Page : 7 Stand-off Fig.5 Fig.6 Tube LED LAMP APPLICATION |
Podobny numer części - 540PY9C |
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Podobny opis - 540PY9C |
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