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LA256B-2YG.HG-PF Arkusz danych(PDF) 8 Page - LIGITEK electronics co., ltd. |
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LA256B-2YG.HG-PF Arkusz danych(HTML) 8 Page - LIGITEK electronics co., ltd. |
8 / 8 page Description The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Test Thermal Shock Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solderability Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs Solder Resistance Test Low Temperature Storage Test Reliability Test: High Temperature Storage Test Operating Life Test Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Item MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Page 7/7 PART NO. LA256B/2YG.HG-PF |
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Podobny opis - LA256B-2YG.HG-PF |
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