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LFD4H5-62-XX-SRP9-3 Arkusz danych(PDF) 8 Page - LIGITEK electronics co., ltd. |
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LFD4H5-62-XX-SRP9-3 Arkusz danych(HTML) 8 Page - LIGITEK electronics co., ltd. |
8 / 8 page 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Thermal Shock Test High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs High Temperature Storage Test Low Temperature Storage Test Operating Life Test LFD4H5/62-XX/SRP9-3 Reliability Test: Test Item PART NO. Test Condition MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to see soldering well performed or not. MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Description 7/7 |
Podobny numer części - LFD4H5-62-XX-SRP9-3 |
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Podobny opis - LFD4H5-62-XX-SRP9-3 |
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