SM3261 datasheet(1/6 Pages) ABC

Numer części	SM3261

Szczegółowy opis	MULTILAYER CHIP BEAD

Download	6 Pages

Scroll/Zoom	100%

Producent	ABC [ABC Taiwan Electronics Corp]

Strona internetowa	http://www.atec-group.com

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Peak Temp：260℃ max.

Max time above 230℃ ：50sec max.

Max time above 200℃ ：70sec max.

0.30±0.2

0.50±0.3

0.60±0.4

ABC'S ITEM NO.

ABC'S DWG NO.

SPECIFICATION FOR APPROVAL

d﹒Solderability：

SM3266

SM2029

SM1608

SM3261

SM4516

SM4532

b﹒Operating temp.：-55℃ ---- +125℃

a﹒Storage temp.：-40℃ ---- +105℃

c﹒Terminal Strength：

Ⅳ﹒GENERAL SPECIFICATION：

AR-001A

Solder : Sn96.5 / Ag3 / Cu0.5

Dip time : 4±1 seconds

Solder temp. : 260±5℃

or equivalent

Type

F ( kgf )

time ( sec )

1.0

Flux : Rosin

1.0

0.5

0.6

1.0

1.5

F

250

30±5

100

0

50

150

200

Temperature

+4.0

/ sec max.

℃

Rising Area

d﹒Remark：Products comply with RoHS' requirements

c﹒Terminal electrode：Ag/Ni/Sn

SM1608

SM2029

SM3261

SM3266

SM4516

SM4532

Series

b﹒Internal conductor：Silver or Ag / Pd

a﹒Body：Ferrite

Ⅲ﹒MATERIALS：

Ⅱ﹒SCHEMATIC DIAGRAM：

Ⅰ﹒CONFIGURATION & DIMENSIONS：

NAME

PROD.

REF :

0.8±0.2

1.2±0.2

1.6±0.2

3.2±0.2

B

1.6±0.2

2.0±0.2

3.2±0.2

4.5±0.2

A

1.5±0.2

1.6±0.2

1.1±0.2

1.6±0.2

0.9±0.2

0.8±0.2

C

MULTILAYER CHIP BEAD

A

D

B

260℃

-(1.0 ~ 5.0)

/ sec max.

℃

P eak Temperature:

Forced Cooling Area

Time ( seconds )

100

150

200

70sec max.

50sec max.

150 ~ 200

/ 60 ~ 120sec

℃

Preheat Area

+2.0 ~ 4.0℃

/ sec max.

Reflow Area

250

230℃

b

a

0.7

1.0

2.2

3.0

G

D

0.7

1.0

1.4

3.0

H

c

0.7

1.0

1.1

1.5

I

Unit : m/m

SM□□□□□□□□L□-□□□

G

( PCB Pattrn )

I

PAGE: 1

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SM3261 Arkusz danych(PDF) 1 Page - ABC Taiwan Electronics Corp

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