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CSD17303Q5 Arkusz danych(PDF) 1 Page - Texas Instruments

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Numer części CSD17303Q5
Szczegółowy opis  30V N-Channel NexFET??Power MOSFET
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI - Texas Instruments

CSD17303Q5 Arkusz danych(HTML) 1 Page - Texas Instruments

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background image
1
D
2
D
3
D
4
D
D
5
G
6
S
7
S
8
S
P0094-01
VGS - Gate-to-Source Voltage - V
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
TC = 25°C
TC = 125°C
G006
ID = 25A
Qg - Gate Charge - nC
0
5
10
15
20
25
30
35
0
1
2
3
4
5
6
7
8
G003
ID = 25A
VDS = 15V
CSD17303Q5
www.ti.com
SLPS246A – JANUARY 2010 – REVISED FEBRUARY 2010
30V N-Channel NexFET™ Power MOSFET
Check for Samples: CSD17303Q5
1
FEATURES
PRODUCT SUMMARY
2
Optimized for 5V Gate Drive
VDS
Drain to Source Voltage
30
V
Ultralow Qg and Qgd
Qg
Gate Charge Total (4.5V)
18
nC
Low Thermal Resistance
Qgd
Gate Charge Gate to Drain
4
nC
Avalanche Rated
VGS = 3V
2.7
m
RDS(on)
Drain to Source On Resistance
VGS = 4.5V
2
m
Pb Free Terminal Plating
VGS = 8V
1.7
m
RoHS Compliant
VGS(th)
Threshold Voltage
1.1
V
Halogen Free
SON 5-mm × 6-mm Plastic Package
text
text
APPLICATIONS
ORDERING INFORMATION
Notebook Point-of-Load
Device
Package
Media
Qty
Ship
SON 5-mm × 6-mm
13-Inch
Tape and
Point-of-Load Synchronous Buck in
CSD17303Q5
2500
Plastic Package
Reel
Reel
Networking, Telecom and Computing Systems
Optimized for Synchronous FET Applications
text
text
DESCRIPTION
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise stated
VALUE
UNIT
The NexFET™ power MOSFET has been designed
to minimize losses in power conversion applications,
VDS
Drain to Source Voltage
30
V
and optimized for 5V gate drive applications.
VGS
Gate to Source Voltage
+10 / –8
V
Continuous Drain Current, TC = 25°C
100
A
ID
Top View
Continuous Drain Current(1)
32
A
IDM
Pulsed Drain Current, TA = 25°C
(2)
200
A
PD
Power Dissipation(1)
3.2
W
TJ,
Operating Junction and Storage
–55 to 150
°C
TSTG
Temperature Range
Avalanche Energy, single pulse
EAS
530
mJ
ID = 103A, L = 0.1mH, RG = 25Ω
(1)
RqJA = 39°C/W on 1-inch
2 (6.45-cm2), 2-oz. (0.071-mm thick)
Cu pad on a 0.06-inch (1.52-mm) thick FR4 PCB.
(2)
Pulse duration
≤300ms, duty cycle ≤2%"
RDS(on) vs VGS
GATE CHARGE
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
NexFET is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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