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ADV3222ARZ-R7 Arkusz danych(PDF) 6 Page - Analog Devices |
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ADV3222ARZ-R7 Arkusz danych(HTML) 6 Page - Analog Devices |
6 / 20 page ADV3221/ADV3222 Rev. 0 | Page 6 of 20 ABSOLUTE MAXIMUM RATINGS POWER DISSIPATION Table 4. Parameter Rating Supply Voltage (V+ − V−) 12 V Analog Input Voltage V− to V+ Digital Input Voltage 0 V to V+ Output Voltage (Disabled Output) (V+ − 1 V) to (V− + 1 V) Output Short-Circuit Duration Momentary Output Short-Circuit Current 50 mA Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering, 10 sec) 300°C Junction Temperature 150°C The ADV3221/ADV3222 are operated with ±5 V supplies and can drive loads down to 150 Ω, resulting in a wide range of possible power dissipations. For this reason, extra care must be taken to adjust the operating conditions based on ambient temperature. Packaged in a 16-lead narrow-body SOIC, the ADV3221 and ADV3222 junction-to-ambient thermal impedance (θJA) is 81°C/W. For long-term reliability, the maximum allowed junction tempera- ture of the die, TJ, should not exceed 125°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in stresses exerted on the die by the package. Figure 4 shows the range of the allowed internal die power dissipations that meet these conditions over the −40°C to +85°C ambient temperature range. When using Figure 4, do not include the external load power in the maximum power calculation, but do include the load current through the die output transistors. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 1.50 1.25 1.00 0.75 0.50 15 25 35 45 55 65 75 85 AMBIENT TEMPERATURE (°C) TJ = 125°C THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 5. Thermal Resistance Package Type θJA θJC Unit 16-Lead Narrow-Body SOIC 81 43 °C/W Figure 4. Maximum Die Power Dissipation vs. Ambient Temperature ESD CAUTION |
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