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ADV3219-EVALZ Arkusz danych(PDF) 5 Page - Analog Devices |
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ADV3219-EVALZ Arkusz danych(HTML) 5 Page - Analog Devices |
5 / 20 page ADV3219/ADV3220 Rev. 0 | Page 5 of 20 ABSOLUTE MAXIMUM RATINGS POWER DISSIPATION Table 3. Parameter Rating Supply Voltage (V+ − V−) 12 V Analog Input Voltage V− to V+ Digital Input Voltage 0 to V+ Output Voltage (Disabled Output) (V+ − 1 V) to (V− + 1 V) Output Short-Circuit Duration Momentary Current 50 mA Temperature Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +85°C Junction Temperature 150°C The ADV3219/ADV3220 are operated with ±5 V supplies and can drive loads down to 150 Ω, resulting in a wide range of possible power dissipations. For this reason, extra care must be taken derating the operating conditions based on ambient temperature. Packaged in an 8-lead LFCSP, the ADV3219 and ADV3220 junction-to-ambient thermal impedance (θJA) is 85°C/W. For long- term reliability, the maximum allowed junction temperature of the die, TJ, should not exceed 125°C. Temporarily exceeding this limit can cause a shift in parametric performance due to a change in stresses exerted on the die by the package. Figure 2 shows the range of the allowed internal die power dissipations that meet these conditions over the −40°C to +85°C ambient temperature range. When using Figure 2, do not include the external load power in the maximum power calculation, but do include the load current through the die output transistors. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 1.5 0.3 0.6 0.9 1.2 15 25 35 45 55 65 75 85 AMBIENT TEMPERATURE (°C) TJ = 125°C THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA θJC Unit 8-Lead LFCSP 85 23 °C/W Figure 2. Maximum Die Power Dissipation vs. Ambient Temperature ESD CAUTION |
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