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ADS1147IPWR Arkusz danych(PDF) 3 Page - Texas Instruments |
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ADS1147IPWR Arkusz danych(HTML) 3 Page - Texas Instruments |
3 / 50 page ADS1146 ADS1147 ADS1148 www.ti.com SBAS453C – JULY 2009 – REVISED APRIL 2010 THERMAL INFORMATION ADS1146, ADS1147, ADS1148 THERMAL METRIC(1) UNITS PW 28 qJA Junction-to-ambient thermal resistance(2) 79.5 qJC(top) Junction-to-case(top) thermal resistance (3) 31.8 qJB Junction-to-board thermal resistance (4) 40.9 °C/W yJT Junction-to-top characterization parameter (5) 3.0 yJB Junction-to-board characterization parameter (6) 41.1 qJC(bottom) Junction-to-case(bottom) thermal resistance (7) n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, yJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): ADS1146 ADS1147 ADS1148 |
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