1

FEATURES

V

CC

V

CC

3

2

4

5

1

A

Y

B

GND

DBVPACKAGE

(TOP VIEW)

3

2

4

5

1

A

V

CC

Y

B

GND

A

GND

Y

B

Seemechanicaldrawingsfordimensions.

1

4

2

3

5

DCKPACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOMVIEW)

DESCRIPTION/ORDERING INFORMATION

SN74AUC1G86

SINGLE 2-INPUT EXCLUSIVE-OR GATE

SCES389J – MARCH 2002 – REVISED NOVEMBER 2007

www.ti.com

2

• Available in the Texas Instruments NanoFree™

• Low Power Consumption, 10-µA Max I

CC

Package

• ±8-mA Output Drive at 1.8 V

• Optimized for 1.8-V Operation and Is 3.6-V I/O

• Latch-Up Performance Exceeds 100 mA Per

Tolerant to Support Mixed-Mode Signal

JESD 78, Class II

Operation

• ESD Protection Exceeds JESD 22

• I

–

2000-V Human-Body Model (A114-A)

Operation

–

200-V Machine Model (A115-A)

• Sub-1-V Operable

–

1000-V Charged-Device Model (C101)

• Max t

The SN74AUC1G86 performs the Boolean function Y = A

⊕ B or Y = AB + AB in positive logic.

A common application is as a true/complement element. If the input is low, the other input is reproduced in true

form at the output. If the input is high, the signal on the other input is reproduced inverted at the output.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™

Reel of 3000

SN74AUC1G86YZPR

_ _ _UH_

WCSP (DSBGA) – YZP (Pb-free)

–40

°C to 85°C

SOT (SOT-23) – DBV

Reel of 3000

SN74AUC1G86DBVR

U86_

SOT (SC-70) – DCK

Reel of 3000

SN74AUC1G86DCKR

UH_

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3)

DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2002–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.