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SN74LVC1G66 Arkusz danych(PDF) 1 Page - Texas Instruments

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Numer części SN74LVC1G66
Szczegółowy opis  SINGLE BILATERAL ANALOG SWITCH
Download  20 Pages
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC1G66 Arkusz danych(HTML) 1 Page - Texas Instruments

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FEATURES
3
2
4
5
1
A
VCC
C
B
GND
DBV PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
5
1
A
VCC
C
B
GND
3
2
4
5
1
A
VCC
C
B
GND
A
GND
VCC
C
B
DRL PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
1
4
2
3
5
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
SCES323L – JUNE 2001 – REVISED JANUARY 2007
• Available in the Texas Instruments
• Low On-State Resistance, Typically ≈5.5 Ω
NanoFree™ Package
(V
CC = 4.5 V)
• 1.65-V to 5.5-V V
CC Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• Inputs Accept Voltages to 5.5 V
• ESD Protection Exceeds JESD 22
• Max t
pd of 0.8 ns at 3.3 V
2000-V Human-Body Model (A114-A)
• High On-Off Output Voltage Ratio
200-V Machine Model (A115-A)
• High Degree of Linearity
1000-V Charged-Device Model (C101)
• High Speed, Typically 0.5 ns
(V
CC = 3 V, CL = 50 pF)
This single analog switch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
Reel of 3000
SN74LVC1G66YZPR
_ _ _C6_
(Pb-free)
Reel of 3000
SN74LVC1G66DBVR
SOT (SOT-23) – DBV
C66_
–40
°C to 85°C
Reel of 250
SN74LVC1G66DBVT
Reel of 3000
SN74LVC1G66DCKR
SOT (SC-70) – DCK
Reel of 250
SN74LVC1G66DCKT
C6_
SOT (SOT-553) – DRL
Reel of 4000
SN74LVC1G66DRLR
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
• = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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