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SN74LVC1G66 Arkusz danych(PDF) 1 Page - Texas Instruments |
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SN74LVC1G66 Arkusz danych(HTML) 1 Page - Texas Instruments |
1 / 20 page www.ti.com FEATURES 3 2 4 5 1 A VCC C B GND DBV PACKAGE (TOP VIEW) YZP PACKAGE (BOTTOM VIEW) DCK PACKAGE (TOP VIEW) 3 2 4 5 1 A VCC C B GND 3 2 4 5 1 A VCC C B GND A GND VCC C B DRL PACKAGE (TOP VIEW) See mechanical drawings for dimensions. 1 4 2 3 5 DESCRIPTION/ORDERING INFORMATION SN74LVC1G66 SINGLE BILATERAL ANALOG SWITCH SCES323L – JUNE 2001 – REVISED JANUARY 2007 • Available in the Texas Instruments • Low On-State Resistance, Typically ≈5.5 Ω NanoFree™ Package (V CC = 4.5 V) • 1.65-V to 5.5-V V CC Operation • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • Inputs Accept Voltages to 5.5 V • ESD Protection Exceeds JESD 22 • Max t pd of 0.8 ns at 3.3 V – 2000-V Human-Body Model (A114-A) • High On-Off Output Voltage Ratio – 200-V Machine Model (A115-A) • High Degree of Linearity – 1000-V Charged-Device Model (C101) • High Speed, Typically 0.5 ns (V CC = 3 V, CL = 50 pF) This single analog switch is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP Reel of 3000 SN74LVC1G66YZPR _ _ _C6_ (Pb-free) Reel of 3000 SN74LVC1G66DBVR SOT (SOT-23) – DBV C66_ –40 °C to 85°C Reel of 250 SN74LVC1G66DBVT Reel of 3000 SN74LVC1G66DCKR SOT (SC-70) – DCK Reel of 250 SN74LVC1G66DCKT C6_ SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G66DRLR (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2001–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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