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ADS4146IRGZR Arkusz danych(PDF) 5 Page - Texas Instruments

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Numer części ADS4146IRGZR
Szczegółowy opis  14-/12-Bit, 160/250MSPS, Ultralow-Power ADC
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI - Texas Instruments

ADS4146IRGZR Arkusz danych(HTML) 5 Page - Texas Instruments

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ADS4126, ADS4129
ADS4146, ADS4149
www.ti.com
SBAS483D – NOVEMBER 2009 – REVISED APRIL 2010
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
UNIT
Supply voltage range, AVDD
–0.3 to 2.1
V
Supply voltage range, DRVDD
–0.3 to 2.1
V
Voltage between AGND and DRGND
–0.3 to 0.3
V
Voltage between AVDD to DRVDD (when AVDD leads DRVDD)
0 to 2.1
V
Voltage between DRVDD to AVDD (when DRVDD leads AVDD)
0 to 2.1
V
INP, INM
–0.3 to minimum (1.9, AVDD + 0.3)
V
Voltage applied to input pins
CLKP, CLKM(2), DFS, OE
–0.3 to AVDD + 0.3
V
RESET, SCLK, SDATA, SEN
–0.3 to 3.9
V
Operating free-air temperature range, TA
–40 to +85
°C
Operating junction temperature range, TJ
+125
°C
Storage temperature range, TSTG
–65 to +150
°C
ESD, human body model (HBM)
2
kV
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2)
When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKM is less than |0.3V|.
This prevents the ESD protection diodes at the clock input pins from turning on.
THERMAL CHARACTERISTICS
(1)
PARAMETER
TEST CONDITIONS
TYPICAL VALUE
UNIT
Soldered thermal pad, no airflow
29
°C/W
RqJA
(2)
Soldered thermal pad, 200LFM
22
°C/W
RqJT
(3)
Bottom of package (thermal pad)
1.13
°C/W
(1)
With a JEDEC standard high-K board and 5×5 via array. See the Exposed Pad section in the Application Information.
(2)
RqJA is the thermal resistance from junction to ambient.
(3)
RqJT is the thermal resistance from junction to the thermal pads.
Copyright © 2009–2010, Texas Instruments Incorporated
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