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TS5A3154 Arkusz danych(PDF) 1 Page - Texas Instruments |
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TS5A3154 Arkusz danych(HTML) 1 Page - Texas Instruments |
1 / 26 page 1 FEATURES APPLICATIONS DCUPACKAGE (TOP VIEW) 1 2 3 8 6 COM EN GND NO V+ 7 NC Logic Control 4 5 IN GND 2 YZP PACKAGE (BOTTOMVIEW) GND GND EN COM NC NO IN V+ 1 A1 B1 C1 D1 3 4 8 7 5 6 Logic Control A2 B2 C2 D2 DESCRIPTION/ORDERING INFORMATION TS5A3154 www.ti.com........................................................................................................................................................... SCDS191B – MARCH 2005 – REVISED MAY 2009 5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER • Cell Phones 2 • Specified Make-Before-Break Switching • PDAs • Low ON-State Resistance (0.9 Ω) • Portable Instrumentation • Control Inputs Are 5.5-V Tolerant • Audio and Video Signal Routing • Low Charge Injection • Low-Voltage Data-Acquisition Systems • Excellent ON-State Resistance Matching • Communication Circuits • Low Total Harmonic Distortion (THD) • Modems • 1.65-V to 5.5-V Single-Supply Operation • Hard Drives • Latch-Up Performance Exceeds 100 mA Per • Computer Peripherals JESD 78, Class II • Wireless Terminals and Peripherals • ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) The TS5A3154 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance matching. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications. ORDERING INFORMATION TA PACKAGE(1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP Reel of 3000 TS5A3157YZPR _ _ _JX_ –40°C to 85°C (Pb-free) SSOP – DCU Reel of 3000 TS5A3157DCUR JCF_ (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2005–2009, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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