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ISL34321 Arkusz danych(PDF) 5 Page - Intersil Corporation |
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ISL34321 Arkusz danych(HTML) 5 Page - Intersil Corporation |
5 / 13 page ISL34321 5 FN6870.1 September 23, 2010 Absolute Maximum Ratings Thermal Information Supply Voltage VDD_P to GND_P, VDD_TX to GND_TX, VDD_IO to GND_IO . . . . . . . . . . . . . . . . -0.5V to 4.6V VDD_CDR to GND_CDR, VDD_CR to GND_CR -0.5V to 2.5V Between any pair of GND_P, GND_TX, GND_IO, GND_CDR, GND_CR . . . . . . . . . . -0.1V to 0.1V 3.3V Tolerant LVTTL/LVCMOS Input Voltage . . . . . . . . . . . . . . . .-0.3V to VDD_IO+0.3V Differential Input Voltage . . . . . . . .-0.3V to VDD_IO + 0.3V Differential Output Current . . . . . . . . Short Circuit Protected LVTTL/LVCMOS Outputs . . . . . . . . . . Short Circuit Protected ESD Rating Human Body Model All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4kV SERIOP/N (all VDD Connected, all GND Connected) . 8kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V Latch Up (Tested per JESD-78B; Class2, Level A). . . .100mA Thermal Resistance (Typical) θJA θJC (°C/W) EPTQFP (Notes 6, 7) . . . . . . . . . . . 38 12 Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . 327mW Maximum Junction Temperature . . . . . . . . . . . . . . +125°C Maximum Storage Temperature Range . . . -65°C to +150°C Operating Temperature Range . . . . . . . . . . -40°C to +85°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 7. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications Unless otherwise indicated, all data is for: VDD_CDR = VDD_CR = 1.8V, VDD_IO = 3.3V, VDD_TX = VDD_P = VDD_AN = 3.3V, TA = +25°C, Ref_Res = 3.16kΩ, High-speed AC-coupling capacitor = 27nF. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY VOLTAGE VDD_CDR, VDD_CR 1.7 1.8 1.9 V VDD_TX, VDD_P, VDD_AN, VDD_IO 3.0 3.3 3.6 V SERIALIZER POWER SUPPLY CURRENTS Total 1.8V Supply Current PCLK_IN = 45MHz 62 80 mA Total 3.3V Supply Current (Note 8) 40 52 mA DESERIALIZER POWER SUPPLY CURRENTS Total 1.8V Supply Current PCLK_IN = 45MHz 66 76 mA Total 3.3V Supply Current (Note 8) 50 63 mA POWER-DOWN SUPPLY CURRENT Total 1.8V Power-Down Supply Current RSTB = GND 10 mA Total 3.3V Power-Down Supply Current 0.5 mA PARALLEL INTERFACE High Level Input Voltage VIH 2.0 V Low Level Input Voltage VIL 0.8 V Input Leakage Current IIN -1 ±0.01 1 µA High Level Output Voltage VOH IOH = -4.0mA, VDD_IO = 3.0V 2.6 V Low Level Output Voltage VOL IOL = 4.0mA, VDD_IO = 3.6V 0.4 V Output Short Circuit Current IOSC 35 mA |
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