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74LVTH373WM Arkusz danych(PDF) 1 Page - Fairchild Semiconductor |
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74LVTH373WM Arkusz danych(HTML) 1 Page - Fairchild Semiconductor |
1 / 10 page ©1999 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LVT373, 74LVTH373 Rev. 1.5.0 February 2008 74LVT373, 74LVTH373 Low Voltage Octal Transparent Latch with 3-STATE Outputs Features ■ Input and output interface capability to systems at 5V VCC ■ Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH373), also available without bushold feature (74LVT373) ■ Live insertion/extraction permitted ■ Power Up/Down high impedance provides glitch-free bus loading ■ Outputs source/sink –32 mA/+64 mA ■ Functionally compatible with the 74 series 373 ■ ESD performance: – Human-body model > 2000V – Machine model > 200V – Charged-device model > 1000V General Description The LVT373 and LVTH373 consist of eight latches with 3-STATE outputs for bus organized system applications. The latches appear transparent to the data when Latch Enable (LE) is HIGH. When LE is LOW, the data satisfy- ing the input timing requirements is latched. Data appears on the bus when the Output Enable (OE) is LOW. When OE is HIGH, the bus output is in a high impedance state. The LVTH373 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs. These octal latches are designed for low-voltage (3.3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment. The LVT373 and LVTH373 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining low power dissipation. Ordering Information Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. Order Number Package Number Package Description 74LVT373WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LVT373SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVT373MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LVTH373WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LVTH373SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVTH373MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide |
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