Symbol

Parameter

Conditions

Min

Typ

Max

Units

T

SD-HYS

Thermal Shutdown Temperature

Hysteresis

T

10

°C

THERMAL RESISTANCE

θ

JA

Junction to Ambient,

ePSOP-8 package

45

°C/W

0 LFPM Air Flow (Note 3)

LLP-8 package

54

°C/W

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the

device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: The human body model is a 100pF capacitor discharged through a 1.5 k

Ω resistor into each pin.

Note 3: Tested on a 4 layer JEDEC board. Four vias provided under the exposed pad. See JESD51-5 and JESD51-7. The value of the

θ

is specifically dependent on the PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation

for the LLP package, refer to Application Note AN-1187.

Note 4: Typical specification represent the most likely parametric norm at 25°C operation.

Note 5: VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading to the pin.

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