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BAS116T Arkusz danych(PDF) 1 Page - Diodes Incorporated

Numer części BAS116T
Szczegółowy opis  SURFACE MOUNT LOW LEAKAGE DIODE
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Producent  DIODES [Diodes Incorporated]
Strona internetowa  http://www.diodes.com
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BAS116T Arkusz danych(HTML) 1 Page - Diodes Incorporated

  BAS116T_09 Datasheet HTML 1Page - Diodes Incorporated BAS116T_09 Datasheet HTML 2Page - Diodes Incorporated BAS116T_09 Datasheet HTML 3Page - Diodes Incorporated  
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BAS116T, BAW156T,
BAV170T, BAV199T
Document number: DS30258 Rev. 12 - 2
1 of 3
www.diodes.com
March 2009
© Diodes Incorporated
BAS116T, BAW156T,
BAV170T, BAV199T
SURFACE MOUNT LOW LEAKAGE DIODE
Features
Ultra-Small Surface Mount Package
Very Low Leakage Current
Lead Free/RoHS Compliant (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
"Green" Device (Notes 3 and 4)
Mechanical Data
Case: SOT-523
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: See Diagrams Below
Marking Information: See Diagrams Below and Page 3
Ordering Information: See Page 2
Weight: 0.002 grams (approximate)
Top View
BAS116T Marking: 50
BAW156T Marking: 53
BAV170T Marking: 51
BAV199T Marking: 52
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
85
V
RMS Reverse Voltage
VR(RMS)
60
V
Forward Continuous Current (Note 1)
Single Diode
Double Diode
IFM
215
125
mA
Repetitive Peak Forward Current
IFRM
500
mA
Non-Repetitive Peak Forward Surge Current
@ t = 1.0
μs
@ t = 1.0ms
@ t = 1.0s
IFSM
4.0
1.0
0.5
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
PD
150
mW
Thermal Resistance Junction to Ambient Air (Note 1)
RθJA
833
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 5)
V(BR)R
85
V
IR = 100μA
Forward Voltage
VF
0.90
1.0
1.1
1.25
V
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
Leakage Current (Note 5)
IR
5.0
80
nA
nA
VR = 75V
VR = 75V, Tj = 150°C
Total Capacitance
CT
2
pF
VR = 0, f = 1.0MHz
Reverse Recovery Time
trr
3.0
μs
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
5. Short duration pulse test used to minimize self-heating effect.
SOT-523
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