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LC821031 Arkusz danych(PDF) 5 Page - Sanyo Semicon Device

Numer części LC821031
Szczegółowy opis  Image-Processing IC for Facsimile, Copier, and OCR Products
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Producent  SANYO [Sanyo Semicon Device]
Strona internetowa  https://www.sanyo-av.com/us/
Logo SANYO - Sanyo Semicon Device

LC821031 Arkusz danych(HTML) 5 Page - Sanyo Semicon Device

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PS No. 5735-5/5
LC821031
This catalog provides information as of February, 1998. Specifications and information herein are subject to
change without notice.
s No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace
equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of
which may directly or indirectly cause injury, death or property loss.
s Anyone purchasing any products described or contained herein for an above-mentioned use shall:
ΠAccept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and
distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all
damages, cost and expenses associated with such use:
 Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on
SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees
jointly or severally.
s Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for
volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied
regarding its use or any infringements of intellectual property rights or other rights of third parties.
Sample Application Circuit
• Use a 0.01 µF monolithic capacitor for C1.
• Applications must set up the polarity of the image signal from the sensor so that white data is at the highest potential
and black data is at the lowest. If the peak level in the image signal from the sensor does not reach 4.2 V, a level
conversion circuit should be added to allow the application to take advantage of the dynamic range of the internal D/A
converter.
• Although AGND and DGND are fully isolated from each other within the IC, AVDD and DVDD are connected through
the substrate. Therefore applications must be designed so that there is no potential difference between AVDD and
DVDD. Also, the rise and fall of these power-supply potentials must occur within 3 ms of each other.
A12 to A0
D7 to D0
PD7 to PD0


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