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LC867140 Arkusz danych(PDF) 5 Page - Sanyo Semicon Device |
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LC867140 Arkusz danych(HTML) 5 Page - Sanyo Semicon Device |
5 / 21 page LC86P7148 No.6692-5/21 Pin Assignment Package Dimension (unit : mm) 3174 SANYO : QIP-80E Notes •The QFP packages should be heat-soaked for 12 hours at 125 °C immediately prior to mounting (This baking is called pre-baking). •After pre-baking a controlled environment must be maintained until soldering. The environment must be held at a temperature of 30 °C or less and a humidity level of 70% or less. Please solder within 24 hours. COM1/PL1 COM2/PL2 COM3/PL3 VSS2 VDD2 P00 P01 P02 P03 P04 P05 P06 P07 P10/SO0 P11/SI0/SB0 P12/SCK0 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 S11/PB3 S10/PB2 S9/PB1 S8/PB0 S7/PA7 S6/PA6 S5/PA5 S4/PA4 S3/PA3 S2/PA2 S1/PA1 S0/PA0 P73/INT3/T0IN P72/INT2/T0IN P71/INT1 P93/DA3/AN11 |
Podobny numer części - LC867140 |
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Podobny opis - LC867140 |
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