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SM802105UMGR Arkusz danych(PDF) 4 Page - Micrel Semiconductor |
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SM802105UMGR Arkusz danych(HTML) 4 Page - Micrel Semiconductor |
4 / 11 page Micrel, Inc. SM802105 April 2011 4 M9999-042111-A hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings (1) Supply Voltage (VDD, VDDOx) ........................................+4.6V Input Voltage (VIN).............................. −0.50V to VDD + 0.5V Lead Temperature (soldering, 20s)............................ 260°C Case Temperature ..................................................... 115°C Storage Temperature (Ts) ......................... −65°C to +150°C Operating Ratings (2) Supply Voltage (VDD, VDDOx)................. +2.375V to +3.465V Ambient Temperature (TA).......................... –40°C to +85°C Junction Thermal Resistance (3) QFN ( θJA) Still-Air......................................................... 50°C/W QFN ( ψJB) Junction-to-Board ....................................... 30°C/W DC Electrical Characteristics (4) VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5% VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5% TA = −40°C to +85°C. Symbol Parameter Condition Min. Typ. Max. Units VDD, VDDOx 2.5V Operating Voltage 2.375 2.5 2.625 V VDD, VDDOx 3.3V Operating Voltage 3.135 3.3 3.465 V 156.25MHz - 1 output 97 125 156.25MHz - 2 outputs 114 148 312.5MHz - 1 output 109 140 IDD REF_IN Supply current VDD + VDDO XTAL_SEL = 0 Outputs open 312.5MHz - 2 outputs 131 170 mA 156.25MHz - 1 output 87 113 156.25MHz - 2 outputs 104 135 312.5MHz - 1 output 99 128 IDD XTAL Supply current VDD + VDDO XTAL_SEL = 1 Outputs open 312.5MHz - 2 outputs 121 158 mA LVPECL DC Electrical Characteristics (4) VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5% VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5% TA = −40°C to +85°C. RL = 50Ω to VDDO − 2V Symbol Parameter Condition Min. Typ. Max. Units VOH Output High Voltage VDDO – 1.145 VDDO – 0.97 VDDO – 0.845 V VOL Output Low Voltage VDDO – 1.945 VDDO – 1.77 VDDO – 1.645 V VSWING Output Voltage Swing 0.6 0.8 1.0 V Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. 4. The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established. |
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