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FAN2564UMP18X Arkusz danych(PDF) 9 Page - Fairchild Semiconductor

Numer części FAN2564UMP18X
Szczegółowy opis  300mA Low VIN LDO for Digital Applications
Download  13 Pages
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Producent  FAIRCHILD [Fairchild Semiconductor]
Strona internetowa  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

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© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2564 • Rev. 1.0.2
9
Application Information
Enable and Soft Start
A 1.4 M
 pull-down resistor ensures the EN pin to be in
LOW state when it is floating. The chip is in shut-down
mode when EN pin is LOW.
To enable the chip, the EN pin needs to be raised higher
than 0.95V. The output pin starts to charge up to the final
voltage. On-chip soft-start circuitry limits the peak inrush
current through VIN pin to less than the specified typical
value of 500mA, regardless of COUT value and load con-
ditions.
The startup time increases as VOUT, COUT, and load in-
creases, but meets the specified 100µs under the worst
load and VOUT conditions.
Short-Circuit and Thermal Protection
The output current is short-circuit protected. When a
short-circuit fault occurs, the output current is automati-
cally limited and VOUT drops, depending on the actual
short-circuit resistance.
Short-circuit fault or output overload may cause the die
temperature to increase and exceed maximum ratings
due to power dissipation. In such cases, depending upon
the ambient temperature; VIN, load current, and the junc-
tion-to-air thermal resistance (θJA) of the die; the device
may enter thermal shutdown.
When the die temperature exceeds the shutdown limit
temperature, the onboard thermal protection disables the
output until the temperature drops below its hysteresis
value, at which point the output is re-enabled and a new
soft-start sequence occurs as described above.
Thermal Considerations
For best performance, the die temperature and the pow-
er dissipated should be kept at moderate values. The
maximum power dissipated can be evaluated based on
the following relationship:
JA
A
(max)
J
(max)
D
T
T
P
(1)
where TJ(max) is the maximum allowable junction tempera-
ture of the die and TA is the ambient operating tempera-
ture. θJA is dependent on the surrounding PCB layout
and can be improved by providing a heat sink of sur-
rounding copper ground.
The addition of backside copper with through-holes, stif-
feners, and other enhancements can also aid in reducing
θJA. The heat contributed by the dissipation of other de-
vices located nearby must be included in design consid-
erations.
Capacitors Selection
The FAN2564 is stable with a wide range of capacitor
values and sizes.
For loop stability, a 1µF input capacitor or bigger is rec-
ommended. Tolerance, temperature, and voltage coeffi-
cients of the capacitor must be considered to ensure
effective capacitance stays around 1µF or above. There
is no special requirement on its ESR value.
An output capacitor with an effective capacitance be-
tween 1µF and 10µF is required for loop stability. The
ESR value should be within 5 to 100m
. 2.2µF or 4.7µF
ceramic capacitors are recommended to ensure stability
over the full temperature, input, and output voltage range
of operation, such as those listed in Table 1.
Table 1. Recommended Capacitors
Capacitance
Size
Vendor
Part Number
1
F
0603
MURATA
GRM188R71C105KA120
2.2
F
0603
MURATA
GRM188R61A225KF340
2.2
F
0402
MURATA
GRM155R60J225ME15
4.7
F
0603
MURATA
GRM188C80G475KE19
4.7
F
0402
MURATA
GRM155R60G475M


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