11/11

REV. B

1. Thermal-shut- down circuit built-in. In case IC chip temperature rise to 175℃ (typ.) thermal-

shut-down circuit operates and output current is muted. Next time IC chip temperature falls below

150℃ (typ.)

2. In case mute-pin voltage under 0.5V or opened, quiescent current is muted. Mute-pin voltage should

be over 2.0V for normal application.

3. In case supply voltage falls below 3.5V (typ.), output current is muted. Next time supply voltage rises

to 3.7V(typ.), the driver blocks start.

4. Bias-pin (pin1 and pin2) should be pulled up more than 1.2V. In case bias-pin voltage is pulled down

under 1.0V (typ.), output current is muted.

5. In case a capacitance load is connected to the OP amplifier output, the amplifier phase margin

decreases, which causes the peak or oscillator.

When connecting such load, insert a resistance in series between the output and the capacitance load

and take a full consideration for frequency characteristics, to prevent problems during practical use.

6. Insert the by-pass capacitor between Vcc-pin and GND-pin of IC as possible as near (approximately

0.1

F).

7. Heat dissipation fins are attached to the GND on the inside of the package. Make sure to connect

these to the external GND

8. Avoid the short-circuits between:

Output pin and Vcc

Output pin and GND

Output pins

If this caution is ignored, IC damage may cause smokes.

9. Examine in consideration of operating margin, when each driver output falls below sub-voltage of

IC (GND) due to counter-electromotive-force of load.

< Supplement >

Current feedback driver

Trans conductance (output current/input voltage) is shown as follws.

WIRE

d

R

R

gm





1

(A／V )

（±0.05）（Typ.）:Au wire