4/4

REV. A

（Pin A）

GND

Parasitic element

Parasitic element

GND

（Pin B）

B

C

E

GND

P substrate

N

P

N

N

P

+

P

+

（Pin B）

Parasitic

Transistor

B

N

E

C

GND

GND

P substrate

N

P

N

N

P

+

P

+

（Pin A）

Resist

Parasitic

○ Precautions for Use

1. Absolute Maximum Rating

Although we pay due attention to the quality control of these products, the possibility of deterioration or destruction may exist

when impressed voltage, operating temperature range, etc., exceed the absolute maximum rating. In addition, it is impossible to

assume a destructive situation, such as short circuit mode, open circuit mode, etc. If a special mode exceeding the absolute

maximum rating is assumed, please review to provide physical safety means such as fuse, etc.

2. GND Potential

Maintain the PGND pin potential at the minimum level under the operating conditions. Furthermore, maintain the pin except the VC

pin at a voltage higher than the PGND pin voltage including an actual transient phenomenon.

The SW pin sometimes is charged by a negative voltage depending on the characteristics of the external transformer.

If any change in or damage of electrical characteristics is suspected due to the SW pin being charged by a negative voltage, it

is recommended that a schottky diode should be connected between the SW pin and the PGND pin.

3. Thermal Design

Work out the thermal design with sufficient margin taking power dissipation (Pd) at the actual operation condition into account.

short

circuit pin . Be careful to design around circuit.

5. Short Circuit between Pins and Incorrect Mounting

Sufficient caution is required for IC direction or displacement when installing IC on PCB. If IC is installed incorrectly, it may be

broken. Also, the threat of destruction may exist in short circuits caused by foreign object invasion between outputs or output

and GND of the power supply.

6. Common Impedance

When providing a power supply and GND wirings, give sufficient consideration to lowering common impedance, reducing ripple (i.e.

making thick and short wiring, reduction ripple by LC, etc.) as much as possible.

Fig.5

Other adjacent elements