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SI7772DP-T1-GE3 Arkusz danych(PDF) 1 Page - Vishay Siliconix |
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SI7772DP-T1-GE3 Arkusz danych(HTML) 1 Page - Vishay Siliconix |
1 / 13 page Vishay Siliconix Si7772DP New Product Document Number: 65169 S09-1822-Rev. A, 14-Sep-09 www.vishay.com 1 N-Channel 30-V (D-S) MOSFET with Schottky Diode FEATURES • Halogen-free According to IEC 61249-2-21 Definition • SkyFET® Monolithic TrenchFET® Gen III Power MOSFET and Schottky Diode • 100 % Rg Tested • 100 % UIS Tested • Compliant to RoHS Directive 2002/95/EC APPLICATIONS • Notebook System Power - Low Side PRODUCT SUMMARY VDS (V) RDS(on) (Ω) ID (A) Qg (Typ.) 30 0.013 at VGS = 10 V 35.6a 8.3 nC 0.0165 at VGS = 4.5 V 31.6 Ordering Information: Si7772DP-T1-GE3 (Lead (Pb)-free and Halogen-free) 1 2 3 4 5 6 7 8 S S S G D D D D 6.15 mm 5.15 mm PowerPAK® SO-8 Bottom View N-Channel MOSFET G S D Schottky Diode Notes: a. Package limited. b. Surface Mounted on 1" x 1" FR4 board. c. t = 10 s. d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under Steady State conditions is 70 °C/W. ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Limit Unit Drain-Source Voltage VDS 30 V Gate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 150 °C) TC = 25 °C ID 35.6a A TC = 70 °C 28.5 TA = 25 °C 12.9b, c TA = 70 °C 10.3b, c Pulsed Drain Current IDM 50 Continuous Source-Drain Diode Current TC = 25 °C IS 27 TA = 25 °C 3.5b, c Single Pulse Avalanche Current L = 0.1 mH IAS 15 Single Pulse Avalanche Energy EAS 11.25 mJ Maximum Power Dissipation TC = 25 °C PD 29.8 W TC = 70 °C 19 TA = 25 °C 3.9b, c TA = 70 °C 2.5b, c Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C Soldering Recommendations (Peak Temperature)d, e 260 THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, f t ≤ 10 s RthJA 27 32 °C/W Maximum Junction-to-Case (Drain) Steady State RthJC 3.5 4.2 |
Podobny numer części - SI7772DP-T1-GE3 |
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Podobny opis - SI7772DP-T1-GE3 |
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