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SI7772DP-T1-GE3 Arkusz danych(PDF) 1 Page - Vishay Siliconix

Numer części SI7772DP-T1-GE3
Szczegółowy opis  N-Channel 30-V (D-S) MOSFET with Schottky Diode
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Producent  VISHAY [Vishay Siliconix]
Strona internetowa  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

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Vishay Siliconix
Si7772DP
New Product
Document Number: 65169
S09-1822-Rev. A, 14-Sep-09
www.vishay.com
1
N-Channel 30-V (D-S) MOSFET with Schottky Diode
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
SkyFET® Monolithic TrenchFET® Gen III
Power MOSFET and Schottky Diode
100 % Rg Tested
100 % UIS Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Notebook System Power
- Low Side
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
ID (A)
Qg (Typ.)
30
0.013 at VGS = 10 V
35.6a
8.3 nC
0.0165 at VGS = 4.5 V
31.6
Ordering Information: Si7772DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
6.15 mm
5.15 mm
PowerPAK® SO-8
Bottom View
N-Channel MOSFET
G
S
D
Schottky Diode
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 70 °C/W.
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
ID
35.6a
A
TC = 70 °C
28.5
TA = 25 °C
12.9b, c
TA = 70 °C
10.3b, c
Pulsed Drain Current
IDM
50
Continuous Source-Drain Diode Current
TC = 25 °C
IS
27
TA = 25 °C
3.5b, c
Single Pulse Avalanche Current
L = 0.1 mH
IAS
15
Single Pulse Avalanche Energy
EAS
11.25
mJ
Maximum Power Dissipation
TC = 25 °C
PD
29.8
W
TC = 70 °C
19
TA = 25 °C
3.9b, c
TA = 70 °C
2.5b, c
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)d, e
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambientb, f
t
≤ 10 s
RthJA
27
32
°C/W
Maximum Junction-to-Case (Drain)
Steady State
RthJC
3.5
4.2


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