ADG5209BRUZ-RL7 datasheet(10/24 Pages) AD

Numer części	ADG5209BRUZ-RL7

Szczegółowy opis	High Voltage, Latch-Up Proof

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Producent	AD [Analog Devices]

Strona internetowa	http://www.analog.com

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10 / 24 page

ADG5208/ADG5209

Data Sheet

Rev. A | Page 10 of 24

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

A0

1

EN

2

VSS 3

S1

4

A1

16

A2

15

GND

14

VDD

13

S2

5

S5

12

S3

6

S6

11

S4

7

S7

10

D

8

S8

9

ADG5208

TOP VIEW

(Not to Scale)

Figure 2. ADG5208 Pin Configuration (TSSOP)

12

11

10

1

3

4

GND

VDD

S5

9

S6

VSS

S2

2

S1

S3

TOP VIEW

(Not to Scale)

ADG5208

NOTES

1. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR

INCREASED RELIABILITY OF THE SOLDER JOINTS AND

MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED

THAT THE PAD BE SOLDERED TO THE SUBSTRATE, VSS.

Figure 3. ADG5208 Pin Configuration (LFCSP)

Table 8. ADG5208 Pin Function Descriptions

Pin No.

TSSOP

LFCSP

Mnemonic

Description

1

15

A0

Logic Control Input.

2

16

EN

Active High Digital Input. When low, the device is disabled and all switches are off. When high, the

Ax logic inputs determine the on switches.

3

1

VSS

Most Negative Power Supply Potential. In single-supply applications, this pin can be connected

to ground.

4

2

S1

Source Terminal 1. This pin can be an input or an output.

5

3

S2

Source Terminal 2. This pin can be an input or an output.

6

4

S3

Source Terminal 3. This pin can be an input or an output.

7

5

S4

Source Terminal 4. This pin can be an input or an output.

8

6

D

Drain Terminal. This pin can be an input or an output.

9

7

S8

Source Terminal 8. This pin can be an input or an output.

10

8

S7

Source Terminal 7. This pin can be an input or an output.

11

9

S6

Source Terminal 6. This pin can be an input or an output.

12

10

S5

Source Terminal 5. This pin can be an input or an output.

13

11

VDD

Most Positive Power Supply Potential.

14

12

GND

Ground (0 V) Reference.

15

13

A2

Logic Control Input.

16

14

A1

Logic Control Input.

EP

Exposed Pad

The exposed pad is connected internally. For increased reliability of the solder joints and

maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.

Table 9. ADG5208 Truth Table

A2

A1

A0

EN

On Switch

X1

0

None

0

1

0

1

2

0

1

0

1

3

0

1

4

1

0

1

5

1

0

1

6

1

0

1

7

1

8

1

X is don’t care.

Podobny numer części - ADG5209BRUZ-RL7

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