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TPA3116D2DADR Arkusz danych(PDF) 5 Page - Texas Instruments

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Numer części TPA3116D2DADR
Szczegółowy opis  15W,30W,50W Filter-Free Class-D Stereo Amplifier Family with AM Avoidance
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI1 - Texas Instruments

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TPA3116D2
TPA3118D2
TPA3130D2
www.ti.com
SLOS708B – APRIL 2012 – REVISED MAY 2012
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Supply voltage, VCC
PVCC, AVCC
–0.3 to 30
V
INPL, INNL, INPR, INNR
–0.3 to 6.3
V
Input voltage, VI
PLIMIT, GAIN / SLV, SYNC
–0.3 to GVDD+0.3
V
AM0, AM1, AM2, MUTE, SDZ, MODSEL
–0.3 to PVCC+0.3
V
Slew rate, maximum(2)
AM0, AM1, AM2, MUTE, SDZ, MODSEL
10
V/msec
Operating free-air temperature, TA
–40 to 85
°C
Operating junction temperature range, TJ
–40 to 150
°C
Storage temperature range, Tstg
–40 to 125
°C
Electrostatic discharge: Human body model, ESD
±2
kV
Electrostatic discharge: Charged device model, ESD
±500
V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
100 k
Ω series resistor is needed if maximum slew rate is exceeded.
THERMAL INFORMATION
TPA3130D2
TPA3118D2
TPA3116D2
DAP
DAP
DAD
THERMAL METRIC(1)
UNITS
1 Layer PCB(2)
2 Layer PCB(3)
Heatsink(4)
32 PINS
32 PINS
32 PINS
θJA
Junction-to-ambient thermal resistance
36
22
14
ψJT
Junction-to-top characterization parameter
0.4
0.3
1.2
°C/W
ψJB
Junction-to-board characterization parameter
5.9
4.8
5.7
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
For the PCB layout please see the TPA3130D2EVM user guide. A 1 layer 90x85mm 1oc PCB was used
(3)
For the PCB layout please see the TPA3130D2EVM user guide. A 2 layer 90x85mm 1oc PCB was used
(4)
The heat sink drawing used for the thermal model data are shown in the application section, size: 14mm wide, 50mm long, 25mm high.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
PVCC, AVCC
4.5
26
V
High-level input
VIH
AM0, AM1, AM2, MUTE, SDZ, SYNC, MODSEL
2
V
voltage
Low-level input
VIL
AM0, AM1, AM2, MUTE, SDZ, SYNC, MODSEL
0.8
V
voltage
Low-level output
VOL
FAULTZ, RPULL-UP = 100 kΩ, PVCC = 26 V
0.8
V
voltage
High-level input
IIH
AM0, AM1, AM2, MUTE, SDZ, MODSEL (VI = 2 V, VCC = 18 V)
50
µA
current
TPA3116D2, TPA3118D2
3.2
4
RL(BTL)
Output filter: L = 10 µH, C = 680 nF
TPA3130D2
5.6
8
Minimum load
Ω
Impedance
TPA3116D2, TPA3118D2
1.6
RL(PBTL)
Output filter: L = 10 µH, C = 1 µF
TPA3130D2
3.2
4
Output-filter
Lo
Minimum output filter inductance under short-circuit condition
1
µH
Inductance
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
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Product Folder Link(s): TPA3116D2 TPA3118D2 TPA3130D2


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