PACKAGE OPTION ADDENDUM

www.ti.com

21-Apr-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins

Package Qty

Eco Plan

(2)

Lead/

Ball Finish

MSL Peak Temp

(3)

Samples

(Requires Login)

TL750M05QKTTRQ1

ACTIVE

DDPAK/

TO-263

KTT

3

500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-245C-168 HR

TL750M05QKVURQ1

ACTIVE

PFM

KVU

3

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-260C-168 HR

TL750M08QKVURQ1

ACTIVE

PFM

KVU

3

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-260C-168 HR

TL750M12QKTTRQ1

ACTIVE

DDPAK/

TO-263

KTT

3

500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-245C-168 HR

TL750M12QKVURQ1

ACTIVE

PFM

KVU

3

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-260C-168 HR

TL751M05QKTTRQ1

ACTIVE

DDPAK/

TO-263

KTT

5

500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-245C-168 HR

TL751M05QKVURQ1

ACTIVE

PFM

KVU

5

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-260C-168 HR

TL751M08QKTTRQ1

ACTIVE

DDPAK/

TO-263

KTT

5

500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-245C-168 HR

TL751M08QKVURQ1

ACTIVE

PFM

KVU

5

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-260C-168 HR

TL751M12QKTTRQ1

ACTIVE

DDPAK/

TO-263

KTT

5

500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-245C-168 HR

TL751M12QKVURQ1

ACTIVE

PFM

KVU

5

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-3-260C-168 HR

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.