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SN74AUP2G34DSFR Arkusz danych(PDF) 2 Page - Texas Instruments

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Numer części SN74AUP2G34DSFR
Szczegółowy opis  LOW-POWER DUAL BUFFER GATE
Download  19 Pages
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI1 - Texas Instruments

SN74AUP2G34DSFR Arkusz danych(HTML) 2 Page - Texas Instruments

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1A
6
1Y
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2A
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2Y
SN74AUP2G34
SCES751B – SEPTEMBER 2009 – REVISED MARCH 2010
www.ti.com
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
NanoStar™ – WCSP (DSBGA)
Reel of 3000
SN74AUP2G34YFPR
_ _ _ H 9 _
0.23-mm Large Bump – YFP (Pb-free)
QFN – DRY
Reel of 5000
SN74AUP2G34DRYR
PZ
–40°C to 85°C
uQFN – DSF
Reel of 5000
SN74AUP2G34DSFR
PZ
SOT (SC-70) – DCK
Reel of 3000
SN74AUP2G34DCKR
PZ_
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3)
DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUT
OUTPUT
A
Y
H
H
L
L
LOGIC DIAGRAM (POSITIVE LOGIC)
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
4.6
V
VI
Input voltage range(2)
–0.5
4.6
V
VO
Voltage range applied to any output in the high-impedance or power-off state(2)
–0.5
4.6
V
VO
Output voltage range in the high or low state(2)
–0.5
VCC + 0.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
Continuous current through VCC or GND
±50
mA
DCK package
252
DRL package
142
qJA
Package thermal impedance(3)
DRY package
234
°C/W
DSF package
300
YFP package
132
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
The package thermal impedance is calculated in accordance with JESD 51-7.
2
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