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SN74AUP2G34DSFR Arkusz danych(PDF) 2 Page - Texas Instruments |
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2 / 19 page 1 1A 6 1Y 3 2A 4 2Y SN74AUP2G34 SCES751B – SEPTEMBER 2009 – REVISED MARCH 2010 www.ti.com This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION(1) TA PACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoStar™ – WCSP (DSBGA) Reel of 3000 SN74AUP2G34YFPR _ _ _ H 9 _ 0.23-mm Large Bump – YFP (Pb-free) QFN – DRY Reel of 5000 SN74AUP2G34DRYR PZ –40°C to 85°C uQFN – DSF Reel of 5000 SN74AUP2G34DSFR PZ SOT (SC-70) – DCK Reel of 3000 SN74AUP2G34DCKR PZ_ (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (3) DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE INPUT OUTPUT A Y H H L L LOGIC DIAGRAM (POSITIVE LOGIC) ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range –0.5 4.6 V VI Input voltage range(2) –0.5 4.6 V VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 4.6 V VO Output voltage range in the high or low state(2) –0.5 VCC + 0.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±20 mA Continuous current through VCC or GND ±50 mA DCK package 252 DRL package 142 qJA Package thermal impedance(3) DRY package 234 °C/W DSF package 300 YFP package 132 Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) The package thermal impedance is calculated in accordance with JESD 51-7. 2 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): SN74AUP2G34 |
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