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TS5V330CPW Arkusz danych(PDF) 5 Page - Texas Instruments |
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TS5V330CPW Arkusz danych(HTML) 5 Page - Texas Instruments |
5 / 22 page TS5V330C www.ti.com SCDS276B – APRIL 2009 – REVISED DECEMBER 2009 PACKAGE THERMAL IMPEDANCE over operating free-air temperature range (unless otherwise noted) UNIT D package(1) 73 DB package(1) 82 θJA Package thermal impedance DBQ package(1) 90 °C/W PW package(1) 108 RGY package(2) 39 (1) The package thermal impedance is calculated in accordance with JESD 51-7. (2) The package thermal impedance is calculated in accordance with JESD 51-5. RECOMMENDED OPERATING CONDITIONS (1) MIN MAX UNIT VCC Supply voltage 4 5.5 V VIH High-level control input voltage (EN, IN) 2 5.5 V VIL Low-level control input voltage (EN, IN) 0 0.8 V VANALOG Analog input/output voltage 0 Vcc V TA Operating free-air temperature –40 85 °C (1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): TS5V330C |
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