PRODUCT DATASHEET

Tina2 series

last update 15/10/2012

GENERAL INFORMATION

- Product series especially designed & optimized for XP-G series of LEDs.

- Special care taken to make light distribution as uniform as possible.

- Lens material optical grade PMMA with high UV and temperature resistance (105 degrees of Celcius / 220

degrees of Fahrenheit). Allows use of high current and temperature conditions.

Please find more information about used material from below:

http://ledil.fi/sites/default/files/Documents/Technical/Material/PMMA%208N%20UL94_Yellow%20Card.pdf

http://ledil.fi/sites/default/files/Documents/Technical/Material/PMMA%208N%20PLEXIGLAS-Datasheet.pdf

- Optic holder molded by high quality PC material (120 dergees of Celcius / 248 degrees of Fahrenheit).

- Fastening to heat sink with a PU foam adhesive tape of automotive grade. Please find fastening details by

clicking link: http://www.ledil.com/datasheets/DataSheet_TAPE.pdf

- Fastening to PCB with appropriate adhesive. By clicking link below you can find Ledil recommended glue

options.

http://www.ledil.com/datasheets/DataSheet_GLUES.pdf

NOTE 1: We advise customer to ensure the suitability and sufficiency of the bond in the end

product. For example, mechanical stress, vibration and holes on the surface of the circuit boar

weaken the strength of the tape.

NOTE 2: Assembly to the surface must be made straight, so the tape bonds constant and

balanced with fastening surface. Slanted assembly might cause unbalanced bond to the

surface. All surfaces where tape is applied must be clean, dry and free from grease and dirt.

If cleaning of PCB surfaces is needed, please follow strictly the cleaning instructions of your

LED manufacturer - this is important as cleaning shall under no circumstances damage LEDs or

other electronics components on the PCB.

Further note that optical components shall not be cleaned with any chemicals - only micro fiber

cloth may be used to remove fingerprints or other traces from handling.

NOTE 1: We advise customer to ensure the suitability and sufficiency of the bond in the end

product. For example, mechanical stress, vibration and holes on the surface of the circuit boar

weaken the strength of the glue.

NOTE 2: All surfaces where glue is applied must be clean, dry and free from grease and dirt. If

cleaning of PCB surfaces is needed, please follow strictly the cleaning instructions of your LED

manufacturer -this is important as cleaning shall under no circumstances damage LEDs or other

electronics components on the PCB.

Further note that optical components shall not be cleaned with any chemicals - only micro fiber

cloth may be used to remove fingerprints or other traces from handling.

October 17th 2012 22:03 Copyright Ledil Oy - Subject to change without prior notice - Page 4/4

Ledil Oy

Salorankatu 10

24240 SALO

Finland

http://www.ledil.com

email: ledil@ledil.com

FAX: +358-2-733 8001