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CSD16407Q5C Arkusz danych(PDF) 1 Page - Texas Instruments

Numer części CSD16407Q5C
Szczegółowy opis  ID The NexFET??power MOSFET has been designed to minimize losses in power conversion applications.
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Strona internetowa  http://www.ti.com
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CSD16407Q5C Arkusz danych(HTML) 1 Page - Texas Instruments

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background image
S
G
S
S
S
D
D
D
D
D
D
D
D
S
G
S
S
Gate
Source
BottomView
Drain
TopView
VGS − GatetoSourceVoltage − V
0
1
2
3
4
5
6
0
2
4
6
8
10
12
G006
ID =25A
TC =125 C
°C
TC =25 C
°
7
Qg − Gate Charge − nC
0
2
4
6
8
10
12
0
5
10
15
20
25
30
35
G003
ID = 25A
VDS = 12.5V
CSD16407Q5C
www.ti.com
SLPS227D – DECEMBER 2009 – REVISED SEPTEMBER 2010
DualCool™ N-Channel NexFET™ Power MOSFET
Check for Samples: CSD16407Q5C
1
FEATURES
PRODUCT SUMMARY
2
Ultralow Qg and Qgd
VDS
Drain to Source Voltage
25
V
DualCool™ Package
Qg
Gate Charge Total (4.5V)
13.3
nC
Optimized for Two Sided Cooling
Qgd
Gate Charge Gate to Drain
3.5
nC
Avalanche Rated
VGS = 4.5V
2.5
m
RDS(on)
Drain to Source On Resistance
VGS = 10V
1.8
m
Pb Free Terminal Plating
V(th)
Threshold Voltage
1.6
V
RoHS Compliant
Halogen Free
ORDERING INFORMATION
SON 5-mm × 6-mm Plastic Package
Device
Package
Media
Qty
Ship
SON 5-mm × 6-mm
13-Inch
Tape and
CSD16407Q5C
2500
APPLICATIONS
Plastic Package
Reel
Reel
Point-of-Load Synchronous Buck Converter
for Applications in Networking, Telecom and
ABSOLUTE MAXIMUM RATINGS
Computing Systems
TA = 25°C unless otherwise stated
VALUE
UNIT
Optimized for Synchronous FET Applications
VDS
Drain to Source Voltage
25
V
VGS
Gate to Source Voltage
+16 / –12
V
DESCRIPTION
Continuous Drain Current, TC = 25°C
100
A
ID
Continuous Drain Current(1)
31
A
The NexFET™ power MOSFET has been designed
to minimize losses in power conversion applications.
IDM
Pulsed Drain Current, TA = 25°C
(2)
200
A
PD
Power Dissipation(1)
3.1
W
TJ,
Operating Junction and Storage
–55 to 150
°C
TSTG
Temperature Range
Avalanche Energy, single pulse
EAS
218
mJ
ID = 66A, L = 0.1mH, RG = 25Ω
(1) Typical
RqJA = 40°C/W on 1-inch
2
(6.45-cm2),
2-oz.
(0.071-mm thick) Cu pad on a 0.06-inch (1.52-mm) thick FR4
PCB.
(2) Pulse duration
≤300ms, duty cycle ≤2%
RDS(on) vs VGS
GATE CHARGE
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
DualCool, NexFET are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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