AD7303

–4–

REV. 0

ABSOLUTE MAXIMUM RATINGS*

Reference Input Voltage to GND . . . .

Operating Temperature Range

Commercial (B Version) . . . . . . . . . . . . . –40

°C to +105°C

Storage Temperature Range

. . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . 800 mW

θ

. . . . . . . . . . . . . . . . . . . . . 117

°C/W

Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +260

°C

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7303 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

PIN CONFIGURATIONS

(DIP, SOIC and microSOIC)

1

2

3

4

8

7

6

5

TOP VIEW

(Not to Scale)

AD7303

SCLK

DIN

SYNC

GND

REF

PIN FUNCTION DESCRIPTIONS

Pin

No.

Mnemonic

Function

Analog Output Voltage from DAC A. The output amplifier swings rail to rail on its output.

Power Supply Input. These parts can be operated from +2.7 V to +5.5 V and should be decoupled to GND.

3

GND

Ground reference point for all circuitry on the part.

4

REF

External Reference Input. This can be used as the reference for both DACs, and is selected by setting the

INT

the internal reference is selected, this voltage will appear as an output for decoupling purposes at the REF Pin.

When using the internal reference, external voltages should not be connected to the REF Pin, see Figure 21.

5

SCLK

Serial Clock. Logic Input. Data is clocked into the input shift register on the rising edge of the serial clock

input. Data can be transferred at rates up to 30 MHz.

6

DIN

Serial Data Input. This device has a 16-bit shift register, 8 bits for data and 8 bits for control. Data is clocked

into the register on the rising edge of the clock input.

7

SYNC

Level Triggered Control Input (active low). This is the frame synchronization signal for the input data. When

SYNC

goes low, it enables the input shift register and data is transferred in on the rising edges of the following

clocks. The rising edge of the SYNC causes the relevant registers to be updated.

Analog output voltage from DAC B. The output amplifier swings rail to rail on its output.

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

θ

. . . . . . . . . . . . . . . . . . . . . 157

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

MicroSOIC Package, Power Dissipation . . . . . . . . . . 450 mW

θ

. . . . . . . . . . . . . . . . . . . . . 206

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

*Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only; functional operation

of the device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.