REV. 0

ADF4001

–3–

10%, 5 V

4.7 k

.)

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADF4001 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

DB20

(MSB)

DB19

DB2

DB1

(CONTROL BIT C2)

CLOCK

DATA

LE

LE

DB0 (LSB)

(CONTROL BIT C1)

Figure 1. Timing Diagram

TIMING CHARACTERISTICS

Limit at

Parameter

(B Version)

Unit

Test Conditions/Comments

10

ns min

DATA to CLOCK Set Up Time

10

ns min

DATA to CLOCK Hold Time

25

ns min

CLOCK High Duration

25

ns min

CLOCK Low Duration

10

ns min

CLOCK to LE Set Up Time

20

ns min

LE Pulsewidth

NOTES

Guaranteed by design but not production tested.

Specifications subject to change without notice.

ABSOLUTE MAXIMUM RATINGS

1, 2

°C unless otherwise noted)

3

. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

±320 mV

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Maximum Junction Temperature . . . . . . . . . . . . . . . . . . 150

°C

TSSOP

CSP

CSP

θ

. . 216

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

< 2 k

Ω and it is ESD sensitive. Proper precautions should be taken for handling

and assembly.

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADF4001BRU

–40

°C to +85°C

Thin Shrink Small Outline Package (TSSOP)

RU-16

ADF4001BCP

–40

°C to +85°C

Chip Scale Package

*

CP-20

*Contact factory for chip availability.