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ADM869LARQ Arkusz danych(PDF) 7 Page - Analog Devices |
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ADM869LARQ Arkusz danych(HTML) 7 Page - Analog Devices |
7 / 8 page REV. A ADM869L –7– FUNCTIONAL DESCRIPTION The ADM869L comprises a high-current P-channel switch con- trolled by an active-low logic input ON (Pin 7). When ON is low, the internal circuitry of the ADM869 is powered up and the output of the current-limit amplifier is low, providing gate drive to the switching FET. When ON is high, the internal circuitry is powered down and the current consumption is typically 100 nA. It should be noted that the ADM869L is not a bidirectional switch, so VIN must always be higher than VOUT. CURRENT LIMIT When the switch is turned on, a smaller mirror switch passes a proportionate current equal to IOUT/955. The mirror amplifier maintains this relationship by keeping the drain of the mirror FET at the same voltage as the main FET, and drives the mirror current through the current-limit resistor RSET, which is connected between the noninverting input of the current limit amplifier and ground. An on-chip bandgap reference of 1.24 V is connected to the inverting input of the current-limit amplifier. When the load current exceeds the preset limit, the voltage across RSET exceeds 1.24 V, and the output voltage of the current-limit amplifier rises, reducing the gate drive to the FETs. If, for example, a 1 A current limit is required, RSET = 1.24 V/ 1.047 mA = 1.184 k Ω. Note that IOUT/ISET varies depending on current so please refer to TPC 6. ADM869L SET RSET 1.24V ILIMIT 955 Figure 1. Setting the Current Limit THERMAL SHUTDOWN The thermal shutdown operates when the die temperature exceeds 135 °C, turning off the switch. The thermal shutdown circuit has built-in hysteresis of 10 °C, so the switch will not turn on again until the die temperature falls to 125 °C. If the fault condition is not removed, the switch will pulse on and off as the temperature cycles between these limits. FAULT OUTPUT If either the current limit or the thermal shutdown is activated, FAULT will pull low. This is an open-drain output and requires a pull-up resistor of between 10 k Ω and 100 kΩ. Several FAULT outputs may be wire-OR’d to form a common interrupt line, as shown in Figure 2 or FAULT may be wire-OR’d to an existing interrupt line that has a resistive pull-up. ADM869L FAULT RPULLUP VPULLUP INT ADM869L FAULT ADM869L FAULT Figure 2. Wire Or’ing FAULT Outputs During startup, the FAULT output goes low for the turn-on time plus 50 µs. APPLICATIONS INFORMATION INPUT FILTERING To prevent the input voltage being pulled below the minimum operating voltage under transient short-circuit conditions, before the current limit has had time to operate, a reservoir capacitor should be connected from IN to GND. This does not need to be large, but should have a low ESR. A 22 µF ceramic type is suitable. Larger values will reduce the voltage drop still further. OUTPUT CAPACITANCE A 0.1 µF capacitor should be connected between OUT and GND to prevent the back e.m.f. of parasitic inductance from pulling OUT below ground during turn-off. For Universal Serial Bus (USB) applications, COUT should be at least 120 µF. This causes the output rise and fall times to be longer, as shown in the typical operating characteristics, but does not affect the turn-off time of the ADM869L itself. LAYOUT CONSIDERATIONS Printed circuit board tracks to and from the ADM869L should be as thick and as short as possible to minimize parasitic inductance and take full advantage of the fast response time of the switch. It is recommended that all input lines be connected together, close to the device. This ensures equal current distribution in all legs. If this is not possible, then all traces should be of equal width and length. The same rules apply for all output lines. Input and output capacitors should be placed as close to the device as possible (less than 5 mm). THERMAL CONSIDERATIONS Under normal operating conditions, the worst-case power dissi- pation will be 518 mW with the highest specified on resistance and 3 V supply (W = 2.4 A × 0.9 V). The package is capable of handling and dissipating this power, but heat dissipation can further be improved by providing a large area of copper in con- tact with the device pins, particularly IN and OUT. |
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