© 2001 Fairchild Semiconductor Corporation

DS500442

www.fairchildsemi.com

February 2001

Revised August 2001

74LCX162374

Low Voltage 16-Bit D-Type Flip-Flop

with 5V Tolerant Inputs and Outputs

and 26

Ω Series Resistors

General Description

The LCX162374 contains sixteen non-inverting D-type

flip-flops with 3-STATE outputs and is intended for bus ori-

ented applications. The device is byte controlled. A buff-

ered clock (CP) and Output Enable (OE) are common to

each byte and can be shorted together for full 16-bit opera-

tion.

The LCX162374 is designed for low voltage (2.5V or 3.3V)

environment. The 26

Ω series resistor in the output helps

reduce output overshoot and undershoot.

The LCX162374 is fabricated with an advanced CMOS

technology to achieve high speed operation while maintain-

ing CMOS low power dissipation.

Features

I 5V tolerant inputs and outputs

I Equivalent 26

Ω series resistor on outputs

I Power down high impedance inputs and outputs

I Supports live insertion/withdrawal (Note 1)

I

I Implements patented noise/EMI reduction circuitry

I Latch-up performance exceeds 500 mA

I ESD performance:

Human body model

> 2000V

Machine model

> 200V

I Also packaged in plastic Fine-Pitch Ball Grid Array

(FBGA) (Preliminary)

Note 1: To ensure the high-impedance state during power up or down, OE

resistor is determined by the current-sourcing capability of the driver.

Ordering Code:

Note 2: BGA package available in Tape and Reel only.

Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Logic Symbol

Order Number

Package Number

Package Description

74LCX162374GX

(Note 2)

BGA54A

(Preliminary)

54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide

[TAPE and REEL]

74LCX162374MEA

(Note 3)

MS48A

48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide

74LCX162374MTD

(Note 3)

MTD48

48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide