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AD7657BSTZ-REEL Arkusz danych(PDF) 10 Page - Analog Devices |
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AD7657BSTZ-REEL Arkusz danych(HTML) 10 Page - Analog Devices |
10 / 32 page AD7656/AD7657/AD7658 Data Sheet Rev. D | Page 10 of 32 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 5. Parameter Rating VDD to AGND, DGND −0.3 V to +16.5 V VSS to AGND, DGND +0.3 V to −16.5 V VDD to AVCC AVCC − 0.3 V to 16.5 V AVCC to AGND, DGND −0.3 V to +7 V DVCC to AVCC −0.3 V to AVCC + 0.3 V DVCC to DGND, AGND −0.3 V to +7 V AGND to DGND −0.3 V to +0.3 V VDRIVE to DGND −0.3 V to DVCC + 0.3 V Analog Input Voltage to AGND1 VSS − 0.3 V to VDD + 0.3 V Digital Input Voltage to DGND −0.3 V to VDRIVE + 0.3 V Digital Output Voltage to GND −0.3 V to VDRIVE + 0.3 V REFIN to AGND −0.3 V to AVCC + 0.3 V Input Current to Any Pin Except Supplies2 ±10 mA Operating Temperature Range B Version −40°C to +85°C Y Version −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Pb/SN Temperature, Soldering Reflow (10 sec to 30 sec) 240(+0)°C Pb-Free Temperature, Soldering Reflow 260(+0)°C 1 If the analog inputs are being driven from alternative VDD and VSS supply circuitry, a 240 Ω series resistor should be placed on the analog inputs. 2 Transient currents of up to 100 mA do not cause SCR latch-up. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. These specifications apply to a four-layer board. Table 6. Thermal Resistance Package Type θJA θJC Unit 64-Lead LQFP 45 11 °C/W ESD CAUTION |
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