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TL3016IDG4 Arkusz danych(PDF) 2 Page - Texas Instruments |
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TL3016IDG4 Arkusz danych(HTML) 2 Page - Texas Instruments |
2 / 17 page TL3016, TL3016Y ULTRA-FAST LOW-POWER PRECISION COMPARATORS SLCS130D – MARCH 1997 – REVISED MARCH 2000 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL3016Y chip information This chip displays characteristics similar to the TL3016C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 10 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJ max = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. TERMINALS 1 AND 6 CAN BE CONNECTED TO MULTIPLE PADS. Q OUT IN– IN+ LATCH ENABLE Q OUT (5) (2) (3) (1) (6) VCC+ GND (7) (8) + – 55 63 VCC – (4) (1) (4) (3) (2) (5) (1) (1) (8) (7) (6) (6) (6) COMPONENT COUNT Bipolars 53 MOSFETs 49 Resistors 46 Capacitors 14 |
Podobny numer części - TL3016IDG4 |
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Podobny opis - TL3016IDG4 |
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